DayStar Technologies

Main Address
13 Corporate Drive
Halfmoon, NY 12065
United States

DayStar Technologies, Inc., has developed a thin film deposition technology for solar photovoltaic (PV) products. It is utilizing its single-stage sputtering deposition process to apply copper indium gallium selenide (CIGS) semiconductor material over large area substrates in a continuous fashion. The manufacturing process for making CIGS modules begins with a cleaning step for the glass substrate followed by a sputter deposition of the back contact material. The back contact is scribed to form the initial cell structure, and then the CIGS deposition is accomplished with its deposition process. The junction partner is deposited on top of the CIGS layer, and the second scribe is accomplished before the final transparent conductive oxide coating is deposited. The monolithic cell structure is completed with the third scribe, a polymer laminate is laid down and the encapsulating glass sheet is bonded to the substrate glass.